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Conference Papers ESAFORM 2021 Year : 2021

An Innovative Welding Solution For Polymer Films in Packaging: Effect of Process Parameters

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Abstract

In this paper, we present an innovative welding process for packaging applications developed by SEALESTER Company. For polymer films, studies have revealed that the welding interface must reach a specific temperature, known as "sealing initiation temperature", to obtain a sealed joint. In this paper, we will be studying the effect of the process parameters on the evolution of temperature at the welding interface. For this purpose, thermocouples have been placed between the films at different points of the trajectory to measure the temperature evolution. Process parameters and temperature measurements were recorded in each experiment. Results show that the most influential parameters are the temperature and the linear velocity of the tool. Rotational frequency affects the heat distribution on the sealing surface. A minimum pressure must be applied. In conclusion, this new process can produce sealed polymer packages. Future work will consist of studying the quality of obtained seal in addition to optimization and control of the process.
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Dates and versions

hal-03515743 , version 1 (06-01-2022)

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Queen Tannous, Yves Bereaux, P. Mousseau, Anaïs Barasinski, Rémi Deterre, et al.. An Innovative Welding Solution For Polymer Films in Packaging: Effect of Process Parameters. ESAFORM 2021, Anne-Marie Habraken, Apr 2021, Liege, Belgium. pp.2788, ⟨10.25518/esaform21.2788⟩. ⟨hal-03515743⟩
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